Successful HZO Ferroelectric Wafer Loops Confirm Functionality Across FAMES Sites, And Advance Europe’s Collaborative Platform for Next-Generation Non-Volatile Memory PRESS RELEASE GRENOBLE, France and DRESDEN, Germany — March  23, 2026 — CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange … Continue reading →

SAN FRANCISCO – Feb. 19, 2025 – Researchers at University of California San Diego (UC San Diego) and CEA-Leti today unveiled a groundbreaking microactuator driving system, combining innovative solid-state battery technology with novel integrated circuit designs for 2-in-1 storage and … Continue reading →

SAN FRANCISCO – Feb. 18, 2025 – CEA-Leti, in its collaboration with Quobly, CEA-List and CEA-Irig, reported today it has developed a unique solution using FD-SOI CMOS technology that provides simultaneous microsecond readouts of tens of quantum devices, while reducing … Continue reading →

GRENOBLE, FRANCE – Feb. 7, 2025 – The FAMES Pilot Line offers a complete set of technologies to develop innovative chip architectures. FAMES will open new research avenues for enhancing performance and lowering power consumption for mixed-signal circuits – and … Continue reading →

Based at CEA-Leti, Collaboration Focuses on Materials Engineering Solutions To Accelerate Semiconductor Device Development for Applied’s ICAPS Customers   SANTA CLARA, Calif. and GRENOBLE, France – Dec. 5, 2023 – Applied Materials, Inc. and CEA-Leti today announced an expansion of … Continue reading →