CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line

Successful HZO Ferroelectric Wafer Loops Confirm Functionality Across FAMES Sites, And Advance Europe’s Collaborative Platform for Next-Generation Non-Volatile Memory PRESS RELEASE GRENOBLE, France and DRESDEN, Germany — March  23, 2026 — CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange … Continue reading

Kerlink Unveils New-Generation Wirnet™ iStation M2 Gateway: Powering the ‘Age of Edge’ in Remote Environments

‘M2 Provides the Ideal Foundation  For Scalable and Reliable Edge IoT Deployments’ PRESS RELEASE Thorigné-Fouillard, France – March 26, 2026, 8:00 a.m. CET – Kerlink, (AKLK –FR0013156007), a global specialist in Internet of Things (IoT) solutions, today announced the launch of its new-generation Wirnet™ iStation … Continue reading