Capacity to Deliver Millions of TFLN Chips Annually ‘Firmly Positions Europe as a Global Leader in Photonic Chip Manufacturing’ June 23, 2025 – A recently concluded 42-month EU project, ELENA, announced today the development of the first-ever, European-made lithium niobate … Continue reading →

Focus Is on Protecting Critical Markets Such as Automotive, Industrial IoT, and Secure Infrastructure GRENOBLE, France – June 18, 2025 – CEA-Leti and Soitec today announced a strategic partnership to enhance the cybersecurity of integrated circuits (ICs) through the innovative … Continue reading →

58 Partners Charged with Implementing Cutting-Edge Solutions For Emission Control, Materials Innovation, Waste Reduction, & Raw Material Reuse GRENOBLE, France – June 6, 2025 – A pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing industry today … Continue reading →

Workshop at CEA-Leti Innovation Days—LID World Summit Begins an Extended Series Of Courses and Training to ‘Shape the Future’ of Europe’s Chip Design and Integration GRENOBLE, France – June 6, 2025 – The FAMES Pilot Line today announced the official … Continue reading →

SAN FRANCISCO – Feb. 19, 2025 – Researchers at University of California San Diego (UC San Diego) and CEA-Leti today unveiled a groundbreaking microactuator driving system, combining innovative solid-state battery technology with novel integrated circuit designs for 2-in-1 storage and … Continue reading →

SAN FRANCISCO – Feb. 18, 2025 – CEA-Leti, in its collaboration with Quobly, CEA-List and CEA-Irig, reported today it has developed a unique solution using FD-SOI CMOS technology that provides simultaneous microsecond readouts of tens of quantum devices, while reducing … Continue reading →

GRENOBLE, FRANCE – Feb. 7, 2025 – The FAMES Pilot Line offers a complete set of technologies to develop innovative chip architectures. FAMES will open new research avenues for enhancing performance and lowering power consumption for mixed-signal circuits – and … Continue reading →

Canada-based Center Brings Wise-integration Closer to U.S. With ‘Perfect Vehicle to Accelerate GaN Adoption Across Power Conversion Markets’ Hyeres, France – Nov. 14, 2024 – Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs for … Continue reading →

Engaging Multiple EU Partners, the Projects Will Apply Intelligent Sensing and AI-Enabled Learning Technologies GRENOBLE, France – April 25, 2024 – As part of the European Union’s drive to support a multifaceted approach to addressing 6G challenges and promises, CEA-Leti … Continue reading →

The Round Includes Leading Deep Tech Funds and Will Enable Mass Production and Commercial Deployment of WiseGan® and WiseWare® Hyeres, France – Feb. 29, 2024 – Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs … Continue reading →