SAN FRANCISCO – Feb. 19, 2025 – Researchers at University of California San Diego (UC San Diego) and CEA-Leti today unveiled a groundbreaking microactuator driving system, combining innovative solid-state battery technology with novel integrated circuit designs for 2-in-1 storage and … Continue reading →

SAN FRANCISCO – Feb. 18, 2025 – CEA-Leti, in its collaboration with Quobly, CEA-List and CEA-Irig, reported today it has developed a unique solution using FD-SOI CMOS technology that provides simultaneous microsecond readouts of tens of quantum devices, while reducing … Continue reading →

GRENOBLE, FRANCE – Feb. 7, 2025 – The FAMES Pilot Line offers a complete set of technologies to develop innovative chip architectures. FAMES will open new research avenues for enhancing performance and lowering power consumption for mixed-signal circuits – and … Continue reading →

Canada-based Center Brings Wise-integration Closer to U.S. With ‘Perfect Vehicle to Accelerate GaN Adoption Across Power Conversion Markets’ Hyeres, France – Nov. 14, 2024 – Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs for … Continue reading →

Engaging Multiple EU Partners, the Projects Will Apply Intelligent Sensing and AI-Enabled Learning Technologies GRENOBLE, France – April 25, 2024 – As part of the European Union’s drive to support a multifaceted approach to addressing 6G challenges and promises, CEA-Leti … Continue reading →

The Round Includes Leading Deep Tech Funds and Will Enable Mass Production and Commercial Deployment of WiseGan® and WiseWare® Hyeres, France – Feb. 29, 2024 – Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs … Continue reading →

CEA-Leti, Fraunhofer, imec and VTT Anchoring Multi-Hub Platform to Realize Designs By EU Companies, Researchers and Chip Developers GRENOBLE, France – Feb. 27, 2024 – A new European Union consortium created to accelerate the development of next-generation, edge-AI technologies is … Continue reading →

Based at CEA-Leti, Collaboration Focuses on Materials Engineering Solutions To Accelerate Semiconductor Device Development for Applied’s ICAPS Customers   SANTA CLARA, Calif. and GRENOBLE, France – Dec. 5, 2023 – Applied Materials, Inc. and CEA-Leti today announced an expansion of … Continue reading →